Client: University of Bayreuth
Article: Upcycling Chips-Bags for Passive Daytime Cooling
Authors: Qimeng Song, Thomas Tran, Kai Herrmann, Holger Schmalz, Markus Retsch
Journal: Advanced Materials Technologies Volume 8, Issue 18, Sep 2023
Publisher: Wiley
Copyright © 2023 Wiley-VCH GmbH
Clever chip bags
I was able to create a cover illustration for the journal Advanced Materials Technologies for Professor Dr. Markus Retsch, Head of the Department of Physical Chemistry at the University of Bayreuth. The article was about his research topic “Cool Chips”. The basis of his research is the film used in crisp packets. This is being repurposed through upcycling to achieve passive cooling of surfaces. I am very happy that my illustration convinced the journal and that the article made it onto the cover!
